Part Details for MC33MR2001RVK by NXP Semiconductors
Overview of MC33MR2001RVK by NXP Semiconductors
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MC33MR2001RVK
MC33MR2001RVK CAD Models
MC33MR2001RVK Part Data Attributes
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MC33MR2001RVK
NXP Semiconductors
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Datasheet
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MC33MR2001RVK
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PBGA85
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B85 | |
| JESD-609 Code | e1 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 85 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.02 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 6 mm |