Part Details for MC33MR2001VVKR2 by NXP Semiconductors
Overview of MC33MR2001VVKR2 by NXP Semiconductors
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MC33MR2001VVKR2
MC33MR2001VVKR2 CAD Models
MC33MR2001VVKR2 Part Data Attributes
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MC33MR2001VVKR2
NXP Semiconductors
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Datasheet
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MC33MR2001VVKR2
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PBGA90
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B90 | |
JESD-609 Code | e1 | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 90 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.02 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 6 mm |