Datasheets
MC35FS4500CAE by: NXP Semiconductors

Interface Circuit

Part Details for MC35FS4500CAE by NXP Semiconductors

Overview of MC35FS4500CAE by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

Price & Stock for MC35FS4500CAE

Part # Distributor Description Stock Price Buy
DISTI # MC35FS4500CAE-ND
DigiKey FS4500 Min Qty: 250 Lead time: 30 Weeks Container: Tray Temporarily Out of Stock
  • 250 $7.0596
$7.0596 Buy Now
DISTI # MC35FS4500CAE
Avnet Americas Power System Basis Chip 48-Pin LQFP Tray - Trays (Alt: MC35FS4500CAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 30 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # 771-MC35FS4500CAE
Mouser Electronics Power Management Specialized - PMIC System Basis chip, Linear 0.5A Vcore, CAN, LQFP48EP, Tray RoHS: Compliant 0
  • 250 $6.3900
  • 500 $6.2500
  • 1,000 $6.0900
$6.0900 / $6.3900 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 750 Package Multiple: 250 Container: Tray 0
Tray
  • 750 $5.0200
$5.0200 Buy Now
DISTI # MC35FS4500CAE
Avnet Americas Power System Basis Chip 48-Pin LQFP Tray - Trays (Alt: MC35FS4500CAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 30 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # MC35FS4500CAE
Avnet Americas Power System Basis Chip 48-Pin LQFP Tray - Trays (Alt: MC35FS4500CAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 30 Weeks, 0 Days Container: Tray 0
RFQ

Part Details for MC35FS4500CAE

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MC35FS4500CAE Part Data Attributes

MC35FS4500CAE NXP Semiconductors
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MC35FS4500CAE NXP Semiconductors Interface Circuit
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LQFP-48
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 30 Weeks
Samacsys Manufacturer NXP
JESD-30 Code S-PQFP-G48
Length 7 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Number of Transceivers 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HLFQFP
Package Equivalence Code QFP48,.35SQ,20
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.6 mm
Surface Mount YES
Technology SMARTMOS
Telecom IC Type INTERFACE CIRCUIT
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm

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