Part Details for MC9S08PA4MTGR by NXP Semiconductors
Overview of MC9S08PA4MTGR by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for MC9S08PA4MTGR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
01AC9298
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Newark | 8 Bit, low End Core, 4K Flash/ Reel Rohs Compliant: Yes |Nxp MC9S08PA4MTGR RoHS: Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.5960 / $0.8070 | Buy Now |
DISTI #
MC9S08PA4MTGR
|
Avnet Americas | 8-bit MCU, HCS08, 20 MHz, 4 KB, 512 Byte, 16 Pins, TSSOP - Tape and Reel (Alt: MC9S08PA4MTGR) RoHS: Compliant Min Qty: 7500 Package Multiple: 2500 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
DISTI #
MC9S08PA4MTGR
|
Avnet Silica | 8-bit MCU, HCS08, 20 MHz, 4 KB, 512 Byte, 16 Pins, TSSOP (Alt: MC9S08PA4MTGR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
MC9S08PA4MTGR
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EBV Elektronik | 8-bit MCU, HCS08, 20 MHz, 4 KB, 512 Byte, 16 Pins, TSSOP (Alt: MC9S08PA4MTGR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MC9S08PA4MTGR
MC9S08PA4MTGR CAD Models
MC9S08PA4MTGR Part Data Attributes
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MC9S08PA4MTGR
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC9S08PA4MTGR
NXP Semiconductors
Microcontroller
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TSSOP, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 8 | |
Clock Frequency-Max | 20 MHz | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-609 Code | e3 | |
Length | 5 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 14 | |
Number of Terminals | 16 | |
PWM Channels | YES | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Speed | 20 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 4.4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |