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Part Details for MCIMX502EVM8B by NXP Semiconductors
Overview of MCIMX502EVM8B by NXP Semiconductors
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Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
Price & Stock for MCIMX502EVM8B
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
MCIMX502EVM8B-ND
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DigiKey | IC MPU I.MX50 800MHZ 400LFBGA Min Qty: 450 Lead time: 15 Weeks Container: Tray | Temporarily Out of Stock |
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$18.8045 | Buy Now |
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DISTI #
841-MCIMX502EVM8B
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Mouser Electronics | Processors - Application Specialized CODEX REV 1.1 RoHS: Compliant | 0 |
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$17.5400 | Order Now |
|
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 450 Package Multiple: 450 Container: Tray | 0Tray |
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$16.5500 | Buy Now |
Part Details for MCIMX502EVM8B
MCIMX502EVM8B CAD Models
MCIMX502EVM8B Part Data Attributes
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MCIMX502EVM8B
NXP Semiconductors
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Datasheet
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MCIMX502EVM8B
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MABGA-400 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 15 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B400 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 400 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA400,20X20,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |