Part Details for MCIMX512DJM8C by Freescale Semiconductor
Overview of MCIMX512DJM8C by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MCIMX512DJM8C
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 84 |
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RFQ |
Part Details for MCIMX512DJM8C
MCIMX512DJM8C CAD Models
MCIMX512DJM8C Part Data Attributes
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MCIMX512DJM8C
Freescale Semiconductor
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Datasheet
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MCIMX512DJM8C
Freescale Semiconductor
i.MX51 32-bit MPU, ARM Cortex-A8 core, 800MHz, MAPBGA 529
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 | |
Pin Count | 529 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B529 | |
JESD-609 Code | e1 | |
Length | 19 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 529 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA529,23X23,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max | 1.15 V | |
Supply Voltage-Min | 1.05 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | SoC |