Part Details for MCIMX534AVP8C2 by NXP Semiconductors
Overview of MCIMX534AVP8C2 by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MCIMX534AVP8C2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
50AJ0063
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Newark | I.mx53 Auto/ Tray Rohs Compliant: Yes |Nxp MCIMX534AVP8C2 Min Qty: 420 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$40.7700 | Buy Now |
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DISTI #
568-MCIMX534AVP8C2-ND
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DigiKey | IC MPU I.MX53 800MHZ 529FBGA Min Qty: 420 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$44.0007 | Buy Now |
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DISTI #
MCIMX534AVP8C2
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Avnet Americas | MPU i.MX53xA RISC 64-Bit 800MHz 1.3V/1.8V/2.5V/2.775V/3.3V 529-Pin TEPBGA T/R - Trays (Alt: MCIMX534AVP8C2) Min Qty: 420 Package Multiple: 420 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$38.5862 / $44.4986 | Buy Now |
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DISTI #
771-MCIMX534AVP8C2
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Mouser Electronics | Processors - Application Specialized I.MX53 AUTO RoHS: Compliant | 0 |
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$41.3800 | Order Now |
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DISTI #
MCIMX534AVP8C2
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Avnet Silica | MPU i.MX53xA RISC 64-Bit 800MHz 1.3V/1.8V/2.5V/2.775V/3.3V 529-Pin TEPBGA T/R (Alt: MCIMX534AVP8C2) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for MCIMX534AVP8C2
MCIMX534AVP8C2 CAD Models
MCIMX534AVP8C2 Part Data Attributes:
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MCIMX534AVP8C2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MCIMX534AVP8C2
NXP Semiconductors
SoC, CMOS, PBGA529
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA-529 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 13 Weeks | |
| JESD-30 Code | S-PBGA-B529 | |
| Length | 19 mm | |
| Number of Terminals | 529 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA529,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |