Datasheets
MCIMX6U5DVM10ADR by:

SoC, CMOS, PBGA624

Part Details for MCIMX6U5DVM10ADR by NXP Semiconductors

Overview of MCIMX6U5DVM10ADR by NXP Semiconductors

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Applications Industrial Automation Renewable Energy Robotics and Drones

Price & Stock for MCIMX6U5DVM10ADR

Part # Distributor Description Stock Price Buy
DISTI # 42AC4969
Newark I.mx 6Dl Rom Perf Enhan/ Reel Rohs Compliant: Yes |Nxp MCIMX6U5DVM10ADR Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 250 $32.5000
$32.5000 Buy Now
DISTI # 568-13634-1-ND
DigiKey IC MPU I.MX6DL 1.0GHZ 624MAPBGA Min Qty: 1 Lead time: 18 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) Temporarily Out of Stock
  • 1 $49.6800
  • 500 $34.7542
$34.7542 / $49.6800 Buy Now
DISTI # MCIMX6U5DVM10ADR
Avnet Americas i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R - Tape and Reel (Alt: MCIMX6U5DVM10ADR) Min Qty: 500 Package Multiple: 500 Lead time: 18 Weeks, 0 Days Container: Reel 500
  • 500 $34.1711
  • 1,000 $33.4543
  • 2,000 $32.4984
  • 3,000 $32.0205
  • 4,000 $31.3036
  • 5,000 $30.5867
  • 50,000 $29.6309
$29.6309 / $34.1711 Buy Now
DISTI # MCIMX6U5DVM10ADR
Avnet Americas i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R - Tape and Reel (Alt: MCIMX6U5DVM10ADR) Min Qty: 500 Package Multiple: 500 Lead time: 18 Weeks, 0 Days Container: Reel 0
  • 500 $34.1711
  • 1,000 $33.4543
  • 2,000 $32.4984
  • 3,000 $32.0205
  • 4,000 $31.3036
  • 5,000 $30.5867
  • 50,000 $29.6309
$29.6309 / $34.1711 Buy Now
DISTI # 771-MCIMX6U5DVM10ADR
Mouser Electronics Processors - Application Specialized i.MX 6DL ROM Perf Enhan RoHS: Compliant 0
  • 500 $34.7600
$34.7600 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Container: Reel 0
Reel
  • 500 $31.8700
$31.8700 Buy Now
DISTI # MCIMX6U5DVM10ADR
Avnet Americas i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R - Tape and Reel (Alt: MCIMX6U5DVM10ADR) Min Qty: 500 Package Multiple: 500 Lead time: 18 Weeks, 0 Days Container: Reel 500
  • 500 $34.1711
  • 1,000 $33.4543
  • 2,000 $32.4984
  • 3,000 $32.0205
  • 4,000 $31.3036
  • 5,000 $30.5867
  • 50,000 $29.6309
$29.6309 / $34.1711 Buy Now
DISTI # MCIMX6U5DVM10ADR
Avnet Americas i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R - Tape and Reel (Alt: MCIMX6U5DVM10ADR) Min Qty: 500 Package Multiple: 500 Lead time: 18 Weeks, 0 Days Container: Reel 0
  • 500 $34.1711
  • 1,000 $33.4543
  • 2,000 $32.4984
  • 3,000 $32.0205
  • 4,000 $31.3036
  • 5,000 $30.5867
  • 50,000 $29.6309
$29.6309 / $34.1711 Buy Now
DISTI # MCIMX6U5DVM10ADR
Avnet Silica i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R (Alt: MCIMX6U5DVM10ADR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 2 Weeks, 6 Days Silica - 0
Buy Now
DISTI # MCIMX6U5DVM10ADR
EBV Elektronik i.MX 6DualLite Applications Processor Dual Core 1GHz Speed 128kB SRAM 512KB Cache with VPU/GPU/MLB/without EPDC 2x ARM Cortex-A9 64-Bit DDR Surface Mount 624-Bump LFBGA T/R (Alt: MCIMX6U5DVM10ADR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 2 Weeks, 6 Days EBV - 0
Buy Now
Flip Electronics Stock, ship today 708
  • 1 $39.9500
$39.9500 RFQ

Part Details for MCIMX6U5DVM10ADR

MCIMX6U5DVM10ADR CAD Models

MCIMX6U5DVM10ADR Part Data Attributes:

MCIMX6U5DVM10ADR NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MCIMX6U5DVM10ADR NXP Semiconductors SoC, CMOS, PBGA624
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description MABGA-624
Reach Compliance Code compliant
Factory Lead Time 18 Weeks
Samacsys Manufacturer NXP
JESD-30 Code S-PBGA-B624
JESD-609 Code e1
Length 21 mm
Moisture Sensitivity Level 3
Number of Terminals 624
Operating Temperature-Max 95 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA624,25X25,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max 1.5 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.4 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 21 mm
uPs/uCs/Peripheral ICs Type SoC

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