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RISC PROCESSOR
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
30Y6571
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Newark | Mpu, 32Bit, Cortex-A9/M4, 800Mhz, Mapbga, Product Range:I.mx 6Solox Series, No. Of Cpu Cores:1Cores, Program Memory Size:-, Ic Case/Package:Mapbga, No. Of Pins:400Pins, Supply Voltage Min:1.15V, Supply Voltage Max:1.3V Rohs Compliant: Yes |Nxp MCIMX6X2AVN08AB Min Qty: 450 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$27.1100 | Buy Now |
DISTI #
MCIMX6X2AVN08AB-ND
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DigiKey | IC MPU I.MX6SX 800MHZ 400MAPBGA Min Qty: 90 Lead time: 15 Weeks Container: Tray | Limited Supply - Call |
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$30.5993 | Buy Now |
DISTI #
MCIMX6X2AVN08AB
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Avnet Americas | MPU i.MX 6 RISC 32-Bit 8MHz/166MHz 400-Pin MAPBGA Tray - Trays (Alt: MCIMX6X2AVN08AB) RoHS: Compliant Min Qty: 450 Package Multiple: 450 Lead time: 15 Weeks, 0 Days Container: Tray | 0 |
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$24.7154 / $28.5025 | Buy Now |
DISTI #
841-MCIMX6X2AVN08AB
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Mouser Electronics | Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 8MHz, ARM Cortex-M4 core, 166MHz, BGA 400 RoHS: Compliant | 0 |
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$28.6000 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 450 Package Multiple: 450 Lead time: 15 Weeks Container: Tray | 0Tray |
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$26.5800 | Buy Now |
DISTI #
MCIMX6X2AVN08AB
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Avnet Silica | MPU i.MX 6 RISC 32-Bit 8MHz/166MHz 400-Pin MAPBGA Tray (Alt: MCIMX6X2AVN08AB) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MCIMX6X2AVN08AB
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EBV Elektronik | MPU i.MX 6 RISC 32-Bit 8MHz/166MHz 400-Pin MAPBGA Tray (Alt: MCIMX6X2AVN08AB) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 17 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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MCIMX6X2AVN08AB
NXP Semiconductors
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Datasheet
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Compare Parts:
MCIMX6X2AVN08AB
NXP Semiconductors
RISC PROCESSOR
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | MAPBGA-400 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 15 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B400 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 400 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA400,20X20,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.53 mm | |
Supply Voltage-Max | 1.5 V | |
Supply Voltage-Min | 1.275 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | SoC |