Part Details for MCR01MRTF4701 by ROHM Semiconductor
Results Overview of MCR01MRTF4701 by ROHM Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MCR01MRTF4701 Information
MCR01MRTF4701 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.
Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.
Part Details for MCR01MRTF4701
MCR01MRTF4701 CAD Models
MCR01MRTF4701 Part Data Attributes
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MCR01MRTF4701
ROHM Semiconductor
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Datasheet
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MCR01MRTF4701
ROHM Semiconductor
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ROHM CO LTD | |
| Package Description | CHIP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8533.21.00.30 | |
| Construction | Chip | |
| JESD-609 Code | e3 | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 155 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Height | 0.35 mm | |
| Package Length | 1 mm | |
| Package Shape | RECTANGULAR PACKAGE | |
| Package Style | SMT | |
| Package Width | 0.5 mm | |
| Packing Method | TR, PAPER, 7 INCH | |
| Rated Power Dissipation (P) | 0.063 W | |
| Rated Temperature | 70 °C | |
| Reference Standard | TS 16949 | |
| Resistance | 4700 Ω | |
| Resistor Type | FIXED RESISTOR | |
| Size Code | 0402 | |
| Surface Mount | YES | |
| Technology | METAL GLAZE/THICK FILM | |
| Temperature Coefficient | 100 ppm/°C | |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier | |
| Terminal Shape | WRAPAROUND | |
| Tolerance | 1% | |
| Working Voltage | 50 V |
Alternate Parts for MCR01MRTF4701
This table gives cross-reference parts and alternative options found for MCR01MRTF4701. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCR01MRTF4701, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| MCWR04X4701FTL | SPC Multicomp | $0.0199 | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | MCR01MRTF4701 vs MCWR04X4701FTL |
| 232270674702L | YAGEO Corporation | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | MCR01MRTF4701 vs 232270674702L |
| RMC1/16SK4701FB | Kamaya Inc | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT | MCR01MRTF4701 vs RMC1/16SK4701FB |
| 9C04021A4701FKPF3 | YAGEO Corporation | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 4700ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | MCR01MRTF4701 vs 9C04021A4701FKPF3 |
| CR0402-16W-4701FPT-13 | VENKEL LTD | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 4700ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | MCR01MRTF4701 vs CR0402-16W-4701FPT-13 |
| RMCS1/16S4.7K1%R | SEI Stackpole Electronics Inc | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT | MCR01MRTF4701 vs RMCS1/16S4.7K1%R |
| 232270684702L | YAGEO Corporation | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT | MCR01MRTF4701 vs 232270684702L |
| RK73H1ELBC4701F | KOA Speer Electronics Inc | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | MCR01MRTF4701 vs RK73H1ELBC4701F |
| SF04P4701FTP | Walsin Technology Corporation | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.125W, 4700ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | MCR01MRTF4701 vs SF04P4701FTP |
| CR0402-10W-4701FPT-13 | VENKEL LTD | Check for Price | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 4700ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | MCR01MRTF4701 vs CR0402-10W-4701FPT-13 |
MCR01MRTF4701 Frequently Asked Questions (FAQ)
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A good PCB layout for the MCR01MRTF4701 involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the device. Additionally, the input voltage should be well-regulated and decoupled with a capacitor.
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The MCR01MRTF4701 can operate in an ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures, so it's recommended to operate within a range of -20°C to +85°C for optimal performance.
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Yes, the MCR01MRTF4701 is suitable for high-reliability applications. ROHM Semiconductor has a rigorous testing and qualification process to ensure the device meets the required standards for reliability and quality.
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The MCR01MRTF4701 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.