Part Details for MCR03EZPFX2703 by ROHM Semiconductor
Results Overview of MCR03EZPFX2703 by ROHM Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MCR03EZPFX2703 Information
MCR03EZPFX2703 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.
Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.
Price & Stock for MCR03EZPFX2703
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 9700 |
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RFQ | ||
DISTI #
MCR03EZPFX2703
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Avnet Abacus | SMD Chip Resistor 270 kOhm 1 100 mW 0603 1608 Metric Thick Film General Purpose (Alt: MCR03EZPFX2703) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 112 Weeks, 0 Days | Abacus - 0 |
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Buy Now | |
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LCSC | 0.1W Thick Film Resistors 100ppm/ 1% 270k 0603 Chip Resistor - Surface Mount ROHS | 2000 |
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$0.0028 / $0.0060 | Buy Now |
Part Details for MCR03EZPFX2703
MCR03EZPFX2703 CAD Models
MCR03EZPFX2703 Part Data Attributes
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MCR03EZPFX2703
ROHM Semiconductor
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Datasheet
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MCR03EZPFX2703
ROHM Semiconductor
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 270000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROHM CO LTD | |
Package Description | CHIP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8533.21.00.30 | |
Construction | Rectangular | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Terminals | 2 | |
Operating Temperature-Max | 155 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.45 mm | |
Package Length | 1.6 mm | |
Package Shape | RECTANGULAR PACKAGE | |
Package Style | SMT | |
Package Width | 0.8 mm | |
Packing Method | TR, PAPER, 7 INCH | |
Rated Power Dissipation (P) | 0.1 W | |
Rated Temperature | 70 °C | |
Reference Standard | AEC-Q200; IATF 16949 | |
Resistance | 270000 Ω | |
Resistor Type | FIXED RESISTOR | |
Size Code | 0603 | |
Surface Mount | YES | |
Technology | METAL GLAZE/THICK FILM | |
Temperature Coefficient | 100 ppm/°C | |
Terminal Finish | TIN OVER NICKEL | |
Terminal Shape | WRAPAROUND | |
Tolerance | 1% | |
Working Voltage | 50 V |
MCR03EZPFX2703 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other layers. It's also recommended to have a solid ground plane on the layer adjacent to the thermal pad.
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To ensure the stability of the output voltage, it's recommended to use a capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. The output capacitor should be placed as close to the output pin as possible, and the PCB layout should be designed to minimize the loop area of the output capacitor and the output pin.
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The maximum input voltage that can be applied to the MCR03EZPFX2703 is 36V. Exceeding this voltage may cause damage to the device.
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The output voltage of the MCR03EZPFX2703 can be calculated using the following formula: Vout = Vref x (1 + R1/R2), where Vref is the internal reference voltage (1.24V), R1 is the resistance between the output pin and the feedback pin, and R2 is the resistance between the feedback pin and ground.
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The minimum input voltage required for the MCR03EZPFX2703 to operate is 2.5V. Operating the device below this voltage may cause instability or malfunction.