Part Details for MCR10EZPJ104 by ROHM Semiconductor
Results Overview of MCR10EZPJ104 by ROHM Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MCR10EZPJ104 Information
MCR10EZPJ104 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.
Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.
Price & Stock for MCR10EZPJ104
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 5000 |
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DISTI #
MCR10EZPJ104
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Avnet Abacus | SMD Chip Resistor 100 kOhm 5 125 mW 0805 2012 Metric Thick Film General Purpose (Alt: MCR10EZPJ104) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 112 Weeks, 0 Days | Abacus - 0 |
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Buy Now | |
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Vyrian | Resistors | 20004 |
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RFQ |
Part Details for MCR10EZPJ104
MCR10EZPJ104 CAD Models
MCR10EZPJ104 Part Data Attributes
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MCR10EZPJ104
ROHM Semiconductor
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Datasheet
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MCR10EZPJ104
ROHM Semiconductor
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 100000ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROHM CO LTD | |
Package Description | CHIP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8533.21.00.30 | |
Samacsys Manufacturer | ROHM Semiconductor | |
Construction | Rectangular | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Terminals | 2 | |
Operating Temperature-Max | 155 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.55 mm | |
Package Length | 2 mm | |
Package Shape | RECTANGULAR PACKAGE | |
Package Style | SMT | |
Package Width | 1.25 mm | |
Packing Method | TR, PAPER, 7 INCH | |
Rated Power Dissipation (P) | 0.125 W | |
Rated Temperature | 70 °C | |
Reference Standard | AEC-Q200; IATF 16949 | |
Resistance | 100000 Ω | |
Resistor Type | FIXED RESISTOR | |
Size Code | 0805 | |
Surface Mount | YES | |
Technology | METAL GLAZE/THICK FILM | |
Temperature Coefficient | 200 ppm/°C | |
Terminal Finish | TIN OVER NICKEL | |
Terminal Shape | WRAPAROUND | |
Tolerance | 5% | |
Working Voltage | 150 V |
MCR10EZPJ104 Frequently Asked Questions (FAQ)
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The recommended land pattern for the MCR10EZPJ104 is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
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To handle thermal considerations for the MCR10EZPJ104, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material (TIM) if the device will be operating at high temperatures or high currents.
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The maximum operating temperature range for the MCR10EZPJ104 is -40°C to 125°C. However, the device can be operated up to 150°C for a short period of time (less than 1000 hours) with a derated current rating.
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To ensure the reliability of the MCR10EZPJ104 in high-reliability applications, follow proper PCB design and assembly guidelines, use a robust soldering process, and consider using a conformal coating to protect the device from environmental factors.
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The MCR10EZPJ104 has an internal ESD protection diode, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device. Use an ESD wrist strap or mat, and store the devices in an anti-static bag or container.