Part Details for MCR10EZPJ152 by ROHM Semiconductor
Results Overview of MCR10EZPJ152 by ROHM Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MCR10EZPJ152 Information
MCR10EZPJ152 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.
Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.
Price & Stock for MCR10EZPJ152
| Part # | Distributor | Description | Stock | Price | Buy | |
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Ameya Holding Limited | RES SMD 1.5K OHM 5% 1/8W 0805 Min Qty: 1 | 4800-Authorized Distributor |
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$0.0078 / $0.1470 | Buy Now RFQ |
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DISTI #
MCR10EZPJ152
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Avnet Abacus | SMD Chip Resistor 15 kOhm 5 125 mW 0805 2012 Metric Thick Film General Purpose (Alt: MCR10EZPJ152) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 112 Weeks, 0 Days | Abacus - 0 |
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Buy Now | |
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DISTI #
MCR10EZPJ152
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Avnet Asia | SMD Chip Resistor, 1.5 kOhm, ? 5%, 125 mW, 0805 [2012 Metric], Thick Film, General Purpose (Alt: MCR10EZPJ152) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 24 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
MCR10EZPJ152
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Chip One Stop | Res Thick Film 0805 1.5K Ohm 5% 0.125W(1/8W) ±200ppm/C Epoxy Resin Pad SMD Automotive T/R RoHS: Compliant pbFree: Yes Min Qty: 100 Lead time: 0 Weeks, 1 Days Container: Cut Tape | 194600 |
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$0.0042 / $0.0111 | Buy Now |
Part Details for MCR10EZPJ152
MCR10EZPJ152 CAD Models
MCR10EZPJ152 Part Data Attributes
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MCR10EZPJ152
ROHM Semiconductor
Buy Now
Datasheet
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MCR10EZPJ152
ROHM Semiconductor
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1500ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Package Description | CHIP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8533.21.00.30 | |
| Samacsys Manufacturer | ROHM Semiconductor | |
| Construction | Rectangular | |
| JESD-609 Code | e3 | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 155 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Height | 0.55 mm | |
| Package Length | 2 mm | |
| Package Shape | RECTANGULAR PACKAGE | |
| Package Style | SMT | |
| Package Width | 1.25 mm | |
| Packing Method | TR, PAPER, 7 INCH | |
| Rated Power Dissipation (P) | 0.125 W | |
| Rated Temperature | 70 °C | |
| Reference Standard | AEC-Q200; IATF 16949 | |
| Resistance | 1500 Ω | |
| Resistor Type | FIXED RESISTOR | |
| Size Code | 0805 | |
| Surface Mount | YES | |
| Technology | METAL GLAZE/THICK FILM | |
| Temperature Coefficient | 200 ppm/°C | |
| Terminal Finish | TIN OVER NICKEL | |
| Terminal Shape | WRAPAROUND | |
| Tolerance | 5% | |
| Working Voltage | 150 V |
MCR10EZPJ152 Frequently Asked Questions (FAQ)
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The recommended land pattern for the MCR10EZPJ152 can be found in the ROHM Semiconductor's packaging specification document, which is usually available on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
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The MCR10EZPJ152 has a high power dissipation rating, so proper thermal management is crucial. Engineers can use thermal vias, thermal pads, or heat sinks to dissipate heat. The thermal resistance of the component and the PCB should be considered, and thermal simulations can be run to ensure the component operates within its specified temperature range.
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The recommended soldering profile for the MCR10EZPJ152 can be found in the ROHM Semiconductor's soldering guidelines document. The document provides information on the recommended soldering temperature, time, and peak temperature to ensure reliable solder joints.
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The MCR10EZPJ152 is a surface-mount device, and its reliability in high-vibration environments depends on the PCB design, component placement, and solder joint quality. Engineers should consider using additional mechanical support, such as underfill or potting, to ensure the component remains securely attached to the PCB.
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Proper decoupling of the MCR10EZPJ152 is crucial to ensure stable operation. Engineers should use a combination of ceramic and electrolytic capacitors, placed close to the component, to filter out noise and reduce voltage ripple. The decoupling capacitor values and placement should be determined based on the specific application and operating conditions.