Part Details for MCR10EZPJ1R0 by ROHM Semiconductor
Results Overview of MCR10EZPJ1R0 by ROHM Semiconductor
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MCR10EZPJ1R0 Information
MCR10EZPJ1R0 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.
Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.
Part Details for MCR10EZPJ1R0
MCR10EZPJ1R0 CAD Models
MCR10EZPJ1R0 Part Data Attributes
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MCR10EZPJ1R0
ROHM Semiconductor
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Datasheet
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MCR10EZPJ1R0
ROHM Semiconductor
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1ohm, 150V, 5% +/-Tol, 400ppm/Cel, Surface Mount, 0805, CHIP
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROHM CO LTD | |
Package Description | CHIP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8533.21.00.30 | |
Samacsys Manufacturer | ROHM Semiconductor | |
Construction | Rectangular | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Terminals | 2 | |
Operating Temperature-Max | 155 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.55 mm | |
Package Length | 2 mm | |
Package Shape | RECTANGULAR PACKAGE | |
Package Style | SMT | |
Package Width | 1.25 mm | |
Packing Method | TR, PAPER, 7 INCH | |
Rated Power Dissipation (P) | 0.125 W | |
Rated Temperature | 70 °C | |
Reference Standard | AEC-Q200; IATF 16949 | |
Resistance | 1 Ω | |
Resistor Type | FIXED RESISTOR | |
Size Code | 0805 | |
Surface Mount | YES | |
Technology | METAL GLAZE/THICK FILM | |
Temperature Coefficient | 400 ppm/°C | |
Terminal Finish | TIN OVER NICKEL | |
Terminal Shape | WRAPAROUND | |
Tolerance | 5% | |
Working Voltage | 150 V |
MCR10EZPJ1R0 Frequently Asked Questions (FAQ)
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The recommended land pattern for the MCR10EZPJ1R0 can be found in the ROHM Semiconductor's packaging specification document, which is usually available on their website. The document provides detailed information on the recommended pad layout, solder mask, and soldering conditions for the device.
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To prevent damage during assembly, it is recommended to handle the MCR10EZPJ1R0 by the edges, avoid touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD). Additionally, the device should be stored in an anti-static bag or container when not in use.
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The thermal resistance of the MCR10EZPJ1R0 is typically not provided in the datasheet, but it can be estimated based on the package type and size. For the MCR10EZPJ1R0, which is a 0603 package, the thermal resistance is typically around 200-300°C/W. However, this value can vary depending on the specific application and board design.
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The MCR10EZPJ1R0 is rated for operation up to 125°C, but it can be used in high-temperature environments with some derating. However, it is recommended to consult with ROHM Semiconductor's application engineers or refer to their reliability handbook for more information on high-temperature operation and derating guidelines.
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The reliability of the MCR10EZPJ1R0 can be determined by referring to ROHM Semiconductor's reliability handbook, which provides information on the device's failure rates, MTBF (mean time between failures), and other reliability metrics. Additionally, the device's reliability can be evaluated based on its operating conditions, such as temperature, voltage, and current.