Datasheets
MCR10EZPJ1R0 by: ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1ohm, 150V, 5% +/-Tol, 400ppm/Cel, Surface Mount, 0805, CHIP

Part Details for MCR10EZPJ1R0 by ROHM Semiconductor

Results Overview of MCR10EZPJ1R0 by ROHM Semiconductor

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MCR10EZPJ1R0 Information

MCR10EZPJ1R0 by ROHM Semiconductor is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.

Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.

Part Details for MCR10EZPJ1R0

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MCR10EZPJ1R0 Part Data Attributes

MCR10EZPJ1R0 ROHM Semiconductor
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MCR10EZPJ1R0 ROHM Semiconductor Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1ohm, 150V, 5% +/-Tol, 400ppm/Cel, Surface Mount, 0805, CHIP
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ROHM CO LTD
Package Description CHIP
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8533.21.00.30
Samacsys Manufacturer ROHM Semiconductor
Construction Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2
Operating Temperature-Max 155 °C
Operating Temperature-Min -55 °C
Package Height 0.55 mm
Package Length 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Package Width 1.25 mm
Packing Method TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W
Rated Temperature 70 °C
Reference Standard AEC-Q200; IATF 16949
Resistance 1 Ω
Resistor Type FIXED RESISTOR
Size Code 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 400 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND
Tolerance 5%
Working Voltage 150 V

MCR10EZPJ1R0 Related Parts

MCR10EZPJ1R0 Frequently Asked Questions (FAQ)

  • The recommended land pattern for the MCR10EZPJ1R0 can be found in the ROHM Semiconductor's packaging specification document, which is usually available on their website. The document provides detailed information on the recommended pad layout, solder mask, and soldering conditions for the device.

  • To prevent damage during assembly, it is recommended to handle the MCR10EZPJ1R0 by the edges, avoid touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD). Additionally, the device should be stored in an anti-static bag or container when not in use.

  • The thermal resistance of the MCR10EZPJ1R0 is typically not provided in the datasheet, but it can be estimated based on the package type and size. For the MCR10EZPJ1R0, which is a 0603 package, the thermal resistance is typically around 200-300°C/W. However, this value can vary depending on the specific application and board design.

  • The MCR10EZPJ1R0 is rated for operation up to 125°C, but it can be used in high-temperature environments with some derating. However, it is recommended to consult with ROHM Semiconductor's application engineers or refer to their reliability handbook for more information on high-temperature operation and derating guidelines.

  • The reliability of the MCR10EZPJ1R0 can be determined by referring to ROHM Semiconductor's reliability handbook, which provides information on the device's failure rates, MTBF (mean time between failures), and other reliability metrics. Additionally, the device's reliability can be evaluated based on its operating conditions, such as temperature, voltage, and current.

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