Part Details for ML7050LA by LAPIS Semiconductor Co Ltd
Overview of ML7050LA by LAPIS Semiconductor Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for ML7050LA
ML7050LA CAD Models
ML7050LA Part Data Attributes
|
ML7050LA
LAPIS Semiconductor Co Ltd
Buy Now
Datasheet
|
Compare Parts:
ML7050LA
LAPIS Semiconductor Co Ltd
Telecom IC, CMOS, PBGA48,
|
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
Package Description | FBGA, BGA48,8X8,32 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B48 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 55 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA48,8X8,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |