Datasheets
MMZ2012Y121BTD25 by: TDK Corporation

Ferrite Chip, 1 Function(s), 0.8A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0805, 2 PIN

Part Details for MMZ2012Y121BTD25 by TDK Corporation

Results Overview of MMZ2012Y121BTD25 by TDK Corporation

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Applications Environmental Monitoring Industrial Automation

MMZ2012Y121BTD25 Information

MMZ2012Y121BTD25 by TDK Corporation is a Data Line Filter.
Data Line Filters are under the broader part category of Filters.

A filter is an electronic circuit that selectively allows certain frequencies to pass while attenuating others. They are used to extract desired signals and remove noise. Read more about Filters on our Filters part category page.

Price & Stock for MMZ2012Y121BTD25

Part # Distributor Description Stock Price Buy
Bristol Electronics   Min Qty: 18 4000
  • 18 $0.2925
  • 53 $0.1462
  • 343 $0.0877
  • 1,712 $0.0585
$0.0585 / $0.2925 Buy Now
DISTI # MMZ2012Y121BTD25
Avnet Abacus Ferrite Bead 0805 2012 Metric 120 Ohm 800 mA 120 Milliohm 25 (Alt: MMZ2012Y121BTD25) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 143 Weeks, 0 Days Abacus - 0
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Part Details for MMZ2012Y121BTD25

MMZ2012Y121BTD25 CAD Models

MMZ2012Y121BTD25 Part Data Attributes

MMZ2012Y121BTD25 TDK Corporation
Buy Now Datasheet
Compare Parts:
MMZ2012Y121BTD25 TDK Corporation Ferrite Chip, 1 Function(s), 0.8A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0805, 2 PIN
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TDK CORP
Package Description EIA STD PACKAGE SIZE 0805, SMD, 2 PIN
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8504.50.80.00
Samacsys Manufacturer TDK
Additional Feature AEC-Q200
Construction Chip Bead
DC Resistance-Max 0.12 Ω
Filter Type FERRITE CHIP
Height 0.85 mm
Length 2 mm
Mounting Type SURFACE MOUNT
Number of Functions 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Impedance 120 OHM Ω
Packing Method TR, 7 INCH
Rated Current 0.8 A
Screening Level AEC-Q200
Width 1.25 mm

MMZ2012Y121BTD25 Related Parts

MMZ2012Y121BTD25 Frequently Asked Questions (FAQ)

  • The recommended land pattern for MMZ2012Y121BTD25 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 0.5mm x 0.5mm.

  • During reflow soldering, the component should be placed on a flat, even surface to prevent warping or bending. The component should be aligned with the PCB pads and secured with a small amount of adhesive or tape to prevent movement during the reflow process.

  • The maximum operating temperature for MMZ2012Y121BTD25 is 125°C, with a derating of 1.25% per °C above 85°C. It's essential to ensure that the component does not exceed this temperature to prevent damage or degradation.

  • While MMZ2012Y121BTD25 is designed to be robust, it's not recommended for use in high-vibration environments without proper mounting and securing. The component should be securely attached to the PCB using a suitable adhesive or mechanical fastening to prevent movement or damage.

  • MMZ2012Y121BTD25 components should be stored in a dry, cool place, away from direct sunlight and moisture. The components should be stored in their original packaging or in a sealed container to prevent damage or degradation.

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