There are no models available for this part yet.
Overview of MPC860ENCZQ50D4 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
MPC860ENCZQ50D4 | Rochester Electronics LLC | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
Price & Stock for MPC860ENCZQ50D4 by NXP Semiconductors
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
MPC860ENCZQ50D4
|
Avnet Americas | MPU MPC8xx RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray - Trays (Alt: MPC860ENCZQ50D4) RoHS: Not Compliant Min Qty: 2 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 8584 Partner Stock |
|
RFQ | ||
Rochester Electronics | MPC860EN - PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, -40 to 95C RoHS: Not Compliant Status: Rochester Active Min Qty: 1 | 8584 |
|
$155.1600 / $182.5400 | Buy Now |
CAD Models for MPC860ENCZQ50D4 by NXP Semiconductors
Part Data Attributes for MPC860ENCZQ50D4 by NXP Semiconductors
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Package Description
|
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
3A991.A.2
|
HTS Code
|
8542.31.00.01
|
Factory Lead Time
|
4 Weeks
|
Samacsys Manufacturer
|
NXP
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
50 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B357
|
JESD-609 Code
|
e0
|
Length
|
25 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
357
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA357,19X19,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.52 mm
|
Speed
|
50 MHz
|
Supply Voltage-Max
|
3.465 V
|
Supply Voltage-Min
|
3.135 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
25 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for MPC860ENCZQ50D4
This table gives cross-reference parts and alternative options found for MPC860ENCZQ50D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860ENCZQ50D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MPC860ENCVR50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860ENCZQ50D4 vs MPC860ENCVR50D4 |
TSPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | MPC860ENCZQ50D4 vs TSPC860MHVZPU50C1 |
MPC860DECZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | MPC860ENCZQ50D4 vs MPC860DECZQ50D4 |
MPC860SRCZP50D4 | MPC860SRCZP50D4 | Motorola Semiconductor Products | MPC860ENCZQ50D4 vs MPC860SRCZP50D4 |
MPC860SRZQ50D4R2 | RISC Microprocessor | NXP Semiconductors | MPC860ENCZQ50D4 vs MPC860SRZQ50D4R2 |
MPC860SRCZQ50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC860ENCZQ50D4 vs MPC860SRCZQ50D4 |
TSXPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, PBGA357 | Microchip Technology Inc | MPC860ENCZQ50D4 vs TSXPC860MHVZPU50C1 |
MPC860TCVR50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC860ENCZQ50D4 vs MPC860TCVR50D4 |
MPC855TZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | MPC860ENCZQ50D4 vs MPC855TZQ50D4 |
XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | MPC860ENCZQ50D4 vs XPC860PZP50D3 |
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