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Programmable Logic / Field Programmable Gate Arrays / MPF300T-FCG484I
Datasheets
MPF300T-FCG484I by:

Field Programmable Gate Array, 300000-Cell, CMOS, PBGA484

Part Details for MPF300T-FCG484I by Microchip Technology Inc

Results Overview of MPF300T-FCG484I by Microchip Technology Inc

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Applications Industrial Automation Electronic Manufacturing

MPF300T-FCG484I Information

MPF300T-FCG484I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for MPF300T-FCG484I

Part # Distributor Description Stock Price Buy
DISTI # 65AH8198
Newark Fpga, 244 I/O, 500Mhz, Fcbga-484, Fpga Type:-, No. Of Logic Cells:300000Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:484Pins, Speed Grade:-, No.of User I/Os:244I/O S, Process Technology:28Nm (Cmos), Ic Mounting:Surface Mount Rohs Compliant: Yes |Microchip MPF300T-FCG484I RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 1 Container: Bulk 0
  • 1 $539.6900
  • 5 $532.1400
  • 10 $524.5900
  • 25 $494.4000
$494.4000 / $539.6900 Buy Now
DISTI # MPF300T-FCG484I
Avnet Americas FPGA, Flash, 28nm (CMOS), DLL, PLL, 244 I/O, 300000 Macrocells, FCBGA-484, PolarFire MPF300T Series - Trays (Alt: MPF300T-FCG484I) RoHS: Not Compliant Min Qty: 2 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray 0
  • 2 $460.4280
  • 4 $452.8438
  • 6 $445.3098
  • 10 $437.7683
  • 20 $434.7648
$434.7648 / $460.4280 Buy Now
DISTI # MPF300T-FCG484I
Microchip Technology Inc PolarFire Mid-Range FPGA, 300KLEs, BGA, Projected EOL: 2049-02-04 RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray 0

Alternates Available

COO: South Korea
  • 1 $496.5800
  • 100 $454.7000
  • 1,000 $314.5000
  • 5,000 $279.5600
$279.5600 / $496.5800 Buy Now
NAC MPF300T-FCG484I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray 0
  • 1 $503.2000
  • 11 $483.8500
  • 20 $471.7500
$471.7500 / $503.2000 Buy Now
DISTI # MPF300T-FCG484I
Avnet Silica FPGA Flash 28nm CMOS DLL PLL 244 IO 300000 Macrocells FCBGA484 PolarFire MPF300T Series (Alt: MPF300T-FCG484I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 0 Days Silica - 0
Buy Now
DISTI # MPF300T-FCG484I
EBV Elektronik FPGA Flash 28nm CMOS DLL PLL 244 IO 300000 Macrocells FCBGA484 PolarFire MPF300T Series (Alt: MPF300T-FCG484I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks, 0 Days EBV - 0
Buy Now
Vyrian Programmable ICs 21
RFQ

Part Details for MPF300T-FCG484I

MPF300T-FCG484I CAD Models

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MPF300T-FCG484I Part Data Attributes

Parametric Data
MPF300T-FCG484I Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
MPF300T-FCG484I Microchip Technology Inc Field Programmable Gate Array, 300000-Cell, CMOS, PBGA484
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description BGA-484
Reach Compliance Code compliant
Factory Lead Time 12 Weeks
Samacsys Manufacturer Microchip
Additional Feature IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY
JESD-30 Code S-PBGA-B484
Length 23 mm
Number of Inputs 244
Number of Logic Cells 300000
Number of Outputs 244
Number of Terminals 484
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.87 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm

MPF300T-FCG484I Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal vias should be placed under the device to dissipate heat efficiently.

  • To optimize the clock tree, use a clock tree synthesis tool to minimize skew and jitter. Also, ensure that the clock signal is routed as a differential pair to reduce noise and EMI.

  • The recommended power-up sequence is to power up the core voltage (VCC) first, followed by the I/O voltage (VCCIO). This ensures that the device powers up correctly and prevents damage.

  • To implement a reliable JTAG interface, use a dedicated JTAG connector and ensure that the JTAG signals are routed as a differential pair. Also, use a JTAG cable with a built-in termination resistor to prevent signal reflections.

  • For high-speed interfaces, use controlled impedance routing, and ensure that the signal traces are short and direct. Also, use a signal integrity analysis tool to simulate and optimize the signal integrity of the design.

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