Part Details for MT29F128G08CECABH1-12:A by Micron Technology Inc
Overview of MT29F128G08CECABH1-12:A by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DC1129A | Analog Devices | LTC3610EUP - 12A, 24V Monolith | |
| LTM4712IY#PBF | Analog Devices | 36VIN, 12A Buck-Boost uModule | |
| LTM4712EY#PBF | Analog Devices | 36VIN, 12A Buck-Boost uModule |
Price & Stock for MT29F128G08CECABH1-12:A
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 74 |
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RFQ |
Part Details for MT29F128G08CECABH1-12:A
MT29F128G08CECABH1-12:A CAD Models
MT29F128G08CECABH1-12:A Part Data Attributes
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MT29F128G08CECABH1-12:A
Micron Technology Inc
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MT29F128G08CECABH1-12:A
Micron Technology Inc
Flash, 16GX8, PBGA100, 12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | VBGA, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 18 mm | |
| Memory Density | 137438953472 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 17179869184 words | |
| Number of Words Code | 16000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | MLC NAND TYPE | |
| Width | 12 mm |