There are no models available for this part yet.
Overview of MT29F128G08CECABH1-12Z:A by Micron Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EV-SOMCRR-EZLITE | Analog Devices | Compact DSP SOM Carrier Evalua | |
| EV-21562-AUTO | Analog Devices | ADSP-21562 Audio Weaver Eval B | |
| ADSP-CM409CBCZAFRL | Analog Devices | ARM Cortex M4 Mixed-Signal BGA |
Price & Stock for MT29F128G08CECABH1-12Z:A by Micron Technology Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
MT29F128G08CECABH1
|
Avnet Americas | MLC NAND Flash Parallel/Serial 3.3V 128Gbit 16G x 8Bit 20ns 100-Pin V-BGA - Bulk (Alt: MT29F128G08CECABH1) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 18 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ |
CAD Models for MT29F128G08CECABH1-12Z:A by Micron Technology Inc
Part Data Attributes for MT29F128G08CECABH1-12Z:A by Micron Technology Inc
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|
|
|---|---|
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Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
MICRON TECHNOLOGY INC
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Part Package Code
|
BGA
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|
Package Description
|
12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100
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Pin Count
|
100
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
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|
Factory Lead Time
|
18 Weeks
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|
JESD-30 Code
|
R-PBGA-B100
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|
JESD-609 Code
|
e1
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Length
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18 mm
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|
Memory Density
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137438953472 bit
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Memory IC Type
|
FLASH
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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100
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Number of Words
|
17179869184 words
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Number of Words Code
|
16000000000
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Operating Mode
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SYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
16GX8
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
VBGA
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Package Shape
|
RECTANGULAR
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Package Style
|
GRID ARRAY, VERY THIN PROFILE
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|
Parallel/Serial
|
PARALLEL
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Programming Voltage
|
2.7 V
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|
Seated Height-Max
|
1 mm
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Supply Voltage-Max (Vsup)
|
3.6 V
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|
Supply Voltage-Min (Vsup)
|
2.7 V
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Supply Voltage-Nom (Vsup)
|
3.3 V
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Surface Mount
|
YES
|
|
Technology
|
CMOS
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|
Temperature Grade
|
COMMERCIAL
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|
Terminal Finish
|
TIN SILVER COPPER
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
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Type
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MLC NAND TYPE
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Width
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12 mm
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