Part Details for MT53D512M32D2DS-053WT:D by Micron Technology Inc
Results Overview of MT53D512M32D2DS-053WT:D by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
MT53D512M32D2DS-053WT:D Information
MT53D512M32D2DS-053WT:D by Micron Technology Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DBL5W5P543A40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB. | |
| DEL2V2P543H40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness. | |
| DC8W8P500H30LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness. |
Price & Stock for MT53D512M32D2DS-053WT:D
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip-Germany GmbH | RoHS: Not Compliant | 117 |
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RFQ |
Part Details for MT53D512M32D2DS-053WT:D
MT53D512M32D2DS-053WT:D CAD Models
MT53D512M32D2DS-053WT:D Part Data Attributes
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MT53D512M32D2DS-053WT:D
Micron Technology Inc
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Datasheet
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MT53D512M32D2DS-053WT:D
Micron Technology Inc
LPDDR4 DRAM, 512MX32, CMOS, PBGA200, WFBGA-200
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | WFBGA-200 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Micron | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Additional Feature | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 1866 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 17179869184 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 512MX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X20,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Standby Current-Max | 0.000002 A | |
| Supply Current-Max | 0.33 mA | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |