Part Details for MTA8ATF51264HZ-2G6B1 by Micron Technology Inc
Overview of MTA8ATF51264HZ-2G6B1 by Micron Technology Inc
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for MTA8ATF51264HZ-2G6B1
MTA8ATF51264HZ-2G6B1 CAD Models
MTA8ATF51264HZ-2G6B1 Part Data Attributes
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MTA8ATF51264HZ-2G6B1
Micron Technology Inc
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MTA8ATF51264HZ-2G6B1
Micron Technology Inc
DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, SODIMM-260
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | DIMM, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | SINGLE BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
JESD-30 Code | R-XZMA-N260 | |
Length | 69.6 mm | |
Memory Density | 38654705664 bit | |
Memory IC Type | DDR DRAM MODULE | |
Memory Width | 72 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 260 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 512MX72 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 30.13 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | NO LEAD | |
Terminal Position | ZIG-ZAG | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3.7 mm |