Datasheets
MTFC128GAZAQJP-IT by: Micron Technology Inc

Flash Card, 128GX8, PBGA153, VFBGA-153

Part Details for MTFC128GAZAQJP-IT by Micron Technology Inc

Results Overview of MTFC128GAZAQJP-IT by Micron Technology Inc

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MTFC128GAZAQJP-IT Information

MTFC128GAZAQJP-IT by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for MTFC128GAZAQJP-IT

Part # Distributor Description Stock Price Buy
DISTI # 13AJ3110
Newark Flash Memory, 128Gb, -40 To 95Deg C, Flash Memory Type:Emmc Nand, Memory Configuration:-, Interfaces:Parallel, Ic Case/Package:Vfbga, No. Of Pins:153Pins, Clock Frequency Max:200Mhz, Access Time:-, Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MTFC128GAZAQJP-IT RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk 2393
  • 1 $38.6900
  • 5 $38.6900
  • 10 $38.6900
  • 25 $38.6900
  • 50 $38.6900
  • 100 $38.6900
$38.6900 Buy Now
DISTI # MTFC128GAZAQJP-IT
Avnet Silica Flash Memory Card 128GB 33V Embedded MMC 153Pin VFBGA Tray (Alt: MTFC128GAZAQJP-IT) RoHS: Compliant Min Qty: 1520 Package Multiple: 1520 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now

Part Details for MTFC128GAZAQJP-IT

MTFC128GAZAQJP-IT CAD Models

MTFC128GAZAQJP-IT Part Data Attributes

MTFC128GAZAQJP-IT Micron Technology Inc
Buy Now Datasheet
Compare Parts:
MTFC128GAZAQJP-IT Micron Technology Inc Flash Card, 128GX8, PBGA153, VFBGA-153
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description VFBGA-153
Reach Compliance Code compliant
Samacsys Manufacturer Micron
Clock Frequency-Max (fCLK) 200 MHz
Data Retention Time-Min 1
JESD-30 Code R-PBGA-B153
Length 13 mm
Memory Density 1099511627776 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 153
Number of Words 137438953472 words
Number of Words Code 128000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min -40 °C
Organization 128GX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA153,14X14,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Programming Voltage 3.3 V
Seated Height-Max 1 mm
Serial Bus Type EMMC 5.1
Standby Current-Max 0.000315 A
Supply Current-Max 0.19 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Type NAND TYPE
Width 11.5 mm

Alternate Parts for MTFC128GAZAQJP-IT

This table gives cross-reference parts and alternative options found for MTFC128GAZAQJP-IT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MTFC128GAZAQJP-IT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

MTFC128GAZAQJP-IT Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for MTFC128GAZAQJP-IT is -40°C to 85°C.

  • To ensure data integrity during power cycling, it is recommended to follow the power-on reset (POR) timing specifications and ensure that the power supply is stable before accessing the device.

  • The recommended method for erasing the device is to use the erase command sequence specified in the datasheet, which includes a series of write cycles to erase the entire device or specific blocks.

  • Bad blocks or defective areas on the device can be handled by using the built-in error correction code (ECC) and bad block management features, which can detect and remap defective areas to maintain data integrity.

  • The recommended method for wear leveling and garbage collection is to use a combination of static wear leveling and dynamic wear leveling algorithms, along with garbage collection mechanisms, to ensure even wear across the device and maintain performance.

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