Part Details for NC7SP17FHX by Fairchild Semiconductor Corporation
Overview of NC7SP17FHX by Fairchild Semiconductor Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for NC7SP17FHX
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-NC7SP17FHX-ND
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DigiKey | BUFFER, P SERIES, 1-FUNC, 1-INPU Min Qty: 3878 Container: Bulk MARKETPLACE PRODUCT |
160000 In Stock |
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$0.0800 | Buy Now |
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Rochester Electronics | Buffer, P Series, 1-Func, 1-Input, CMOS, PDSO6 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 168744 |
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$0.0665 / $0.0782 | Buy Now |
Part Details for NC7SP17FHX
NC7SP17FHX CAD Models
NC7SP17FHX Part Data Attributes
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NC7SP17FHX
Fairchild Semiconductor Corporation
Buy Now
Datasheet
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NC7SP17FHX
Fairchild Semiconductor Corporation
Buffer, P Series, 1-Func, 1-Input, CMOS, PDSO6, 1 X 1MM, 0.35 MM PITCH, GREEN, MO-252, MICROPAK2-6
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | MICROPAK2 | |
| Package Description | 1 X 1MM, 0.35 MM PITCH, GREEN, MO-252, MICROPAK2-6 | |
| Pin Count | 6 | |
| Manufacturer Package Code | 6LD,MICROPAK2,JEDEC MO252,1.0MM SQUARE,.35MM PITCH | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Family | P | |
| JESD-30 Code | S-PDSO-N6 | |
| JESD-609 Code | e4 | |
| Length | 1 mm | |
| Load Capacitance (CL) | 30 pF | |
| Logic IC Type | BUFFER | |
| Max I(ol) | 0.0005 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Inputs | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSON | |
| Package Equivalence Code | SOLCC6,.04,14 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 46.3 ns | |
| Propagation Delay (tpd) | 46.3 ns | |
| Qualification Status | Not Qualified | |
| Schmitt Trigger | YES | |
| Seated Height-Max | 0.55 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 0.9 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.35 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1 mm |