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Part Details for NL7WB66USG by onsemi
Results Overview of NL7WB66USG by onsemi
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Environmental Monitoring
Space Technology
Telecommunications
NL7WB66USG Information
NL7WB66USG by onsemi is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Price & Stock for NL7WB66USG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2381106
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Farnell | ANALOGUE SWITCH, DUAL, SPST, US8 RoHS: Compliant Min Qty: 5 Lead time: 51 Weeks, 1 Days Container: Cut Tape | 77 |
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$0.4141 / $0.4969 | Buy Now |
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DISTI #
NL7WB66USG
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Avnet Americas | Analog Switch Dual SPST 8-Pin US T/R - Tape and Reel (Alt: NL7WB66USG) RoHS: Compliant Min Qty: 3572 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 0 |
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RFQ | |
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DISTI #
70467392
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RS | NL7WB66USG, Analogue Switch Dual SPST, 1.65 - 5.5 V, 8-Pin US Min Qty: 50 Package Multiple: 1 Container: Bulk | 0 |
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$0.4010 | RFQ |
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ComSIT USA | Electronic Component RoHS: Compliant |
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RFQ | |
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NexGen Digital | 11999 |
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RFQ | ||
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DISTI #
NL7WB66USG
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Avnet Asia | Analog Switch Dual SPST 8-Pin US T/R (Alt: NL7WB66USG) RoHS: Compliant Min Qty: 6000 Package Multiple: 3000 | 30000 |
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RFQ | |
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DISTI #
NL7WB66USG
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Avnet Silica | Analog Switch Dual SPST 8Pin US TR (Alt: NL7WB66USG) RoHS: Compliant Min Qty: 6000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
NL7WB66USG
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EBV Elektronik | Analog Switch Dual SPST 8Pin US TR (Alt: NL7WB66USG) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Other Function Semiconductors | 4649 |
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RFQ |
Part Details for NL7WB66USG
NL7WB66USG CAD Models
NL7WB66USG Part Data Attributes
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NL7WB66USG
onsemi
Buy Now
Datasheet
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Compare Parts:
NL7WB66USG
onsemi
Dual SPST Analog Switch, US8, 3000-REEL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | US8 | |
| Package Description | US-8 | |
| Pin Count | 8 | |
| Manufacturer Package Code | 493-01 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | onsemi | |
| Analog IC - Other Type | SPST | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 2.3 mm | |
| Moisture Sensitivity Level | 1 | |
| Normal Position | NO | |
| Number of Channels | 1 | |
| Number of Functions | 2 | |
| Number of Terminals | 8 | |
| Off-state Isolation-Nom | 74 dB | |
| On-state Resistance Match-Nom | 1.5 Ω | |
| On-state Resistance-Max (Ron) | 15 Ω | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Output | SEPARATE OUTPUT | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSSOP | |
| Package Equivalence Code | TSSOP8,.12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Switch-on Time-Max | 10 ns | |
| Switching | MAKE-BEFORE-BREAK | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 2 mm |
NL7WB66USG Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
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Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
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Use a shielded enclosure, and ensure proper grounding and bonding of the device and PCB. Implement EMI filters, and consider using a common-mode choke to reduce emissions.
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Implement a power-saving mode, and consider using a low-dropout regulator (LDO) or a switching regulator with a low quiescent current. Optimize the system's power management scheme to minimize standby power consumption.
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Implement a robust design with adequate margins, ensure proper component selection, and consider using redundancy or error correction mechanisms. Perform thorough testing and validation, and implement a robust manufacturing process.