Part Details for NT2H1001G0DUFV by NXP Semiconductors
Overview of NT2H1001G0DUFV by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for NT2H1001G0DUFV
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
95AC1712
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Newark | Ntag 210U, Nfc Forum Type 2 Tag Compliant Ic With 48 Bytes/ Ffc Rohs Compliant: Yes |Nxp NT2H1001G0DUFV Min Qty: 112373 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$0.0720 | Buy Now |
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DISTI #
NT2H1001G0DUFV-ND
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DigiKey | IC RFID TRANSP 13.56MHZ DIE Min Qty: 112373 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$0.0697 | Buy Now |
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DISTI #
NT2H1001G0DUFV
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Avnet Americas | NT2H1001G0DUF/UNCASED/NO MARK - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: NT2H1001G0DUFV) RoHS: Compliant Min Qty: 112373 Package Multiple: 112373 Lead time: 16 Weeks, 0 Days Container: Waffle Pack | 0 |
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$0.0690 / $0.0762 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 112373 Package Multiple: 112373 Lead time: 16 Weeks | 0 |
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$0.0674 | Buy Now |
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DISTI #
NT2H1001G0DUFV
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Avnet Silica | NT2H1001G0DUF/UNCASED/NO MARK (Alt: NT2H1001G0DUFV) RoHS: Compliant Min Qty: 112373 Package Multiple: 112373 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for NT2H1001G0DUFV
NT2H1001G0DUFV CAD Models
NT2H1001G0DUFV Part Data Attributes
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NT2H1001G0DUFV
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
NT2H1001G0DUFV
NXP Semiconductors
NT2L1001_NT2H1001 - NTAG 210μ, NFC Forum Type 2 Tag compliant IC with 48 bytes
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | WAFER | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | R-XUUC-N | |
| Number of Functions | 1 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Surface Mount | YES | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |