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Signal Circuits / Multiplexers or Switches / NX3DV3899GU,115
Datasheets
NX3DV3899GU,115 by: NXP Semiconductors

NX3DV3899 - Dual double-pole double-throw analog switch QFN 16-Pin

Part Details for NX3DV3899GU,115 by NXP Semiconductors

Results Overview of NX3DV3899GU,115 by NXP Semiconductors

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NX3DV3899GU,115 Information

NX3DV3899GU,115 by NXP Semiconductors is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for NX3DV3899GU,115

Part # Distributor Description Stock Price Buy
DISTI # 64AH7049
Newark Analogue Sw, Dpdt, -40 To 125Deg C Rohs Compliant: Yes |Nxp NX3DV3899GU,115 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape 3414
  • 1 $1.2000
  • 10 $1.0800
  • 25 $1.0200
  • 50 $0.9630
  • 100 $0.9040
  • 250 $0.8590
  • 500 $0.8140
  • 1,000 $0.7060
$0.7060 / $1.2000 Buy Now
DISTI # 41T4275
Newark Dual Double-Pole Double-Throw Analog Switch/ Reel Rohs Compliant: Yes |Nxp NX3DV3899GU,115 RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 3,000 $0.6020
  • 6,000 $0.5470
  • 12,000 $0.4920
  • 18,000 $0.4740
  • 30,000 $0.4630
$0.4630 / $0.6020 Buy Now
DISTI # NX3DV3899GU,115
Avnet Americas Analog Switch Dual DPDT 16-Pin XQFN - Tape and Reel (Alt: NX3DV3899GU,115) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel 0
  • 4,000 $0.4446
  • 8,000 $0.4409
  • 16,000 $0.4373
  • 24,000 $0.4336
  • 32,000 $0.4300
$0.4300 / $0.4446 Buy Now
Rochester Electronics IC ANLG Switch DPDT 16XQFN RoHS: Compliant Status: Active Min Qty: 1 241329
  • 1 $0.5061
  • 25 $0.4960
  • 100 $0.4757
  • 500 $0.4555
  • 1,000 $0.4302
$0.4302 / $0.5061 Buy Now
DISTI # NX3DV3899GU,115
Avnet Silica Analog Switch Dual DPDT 16-Pin XQFN (Alt: NX3DV3899GU,115) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days Silica - 0
Buy Now
DISTI # C1S537100737960
Chip One Stop Low Rds ON DPDT analog switch RoHS: Compliant pbFree: Yes Container: Cut Tape 37
  • 5 $0.3610
$0.3610 Buy Now
DISTI # NX3DV3899GU,115
EBV Elektronik Analog Switch Dual DPDT 16-Pin XQFN (Alt: NX3DV3899GU,115) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now

Part Details for NX3DV3899GU,115

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NX3DV3899GU,115 Part Data Attributes

Parametric Data
NX3DV3899GU,115 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
NX3DV3899GU,115 NXP Semiconductors NX3DV3899 - Dual double-pole double-throw analog switch QFN 16-Pin
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Pin Count 16
Manufacturer Package Code SOT1161-1
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
Analog IC - Other Type DPDT
JESD-30 Code R-PQCC-N16
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Functions 2
Number of Terminals 16
On-state Resistance-Max (Ron) 10 Ω
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY
Package Code QCCN
Package Equivalence Code LCC16,.07X.1,16
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Surface Mount YES
Switch-on Time-Max 90 ns
Switching BREAK-BEFORE-MAKE
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30

Alternate Parts for NX3DV3899GU,115

This table gives cross-reference parts and alternative options found for NX3DV3899GU,115. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NX3DV3899GU,115, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
NLAS3899BMNTXG onsemi Check for Price Analog Switch, Dual DPDT, Low RON, Low Capacitance, QFN16 3x3, 0.5P, 3000-REEL NX3DV3899GU,115 vs NLAS3899BMNTXG
NX3DV3899GU NXP Semiconductors Check for Price DUAL 2-CHANNEL, DBL POLE DBL THROW SWITCH, PQCC16, 1.80 X 2.60 MM, 0.50 MM HEIGHT, PLASTIC, SOT1161-1, QFN-16 NX3DV3899GU,115 vs NX3DV3899GU
NLAS3899BMNTBG onsemi Check for Price Analog Switch, Dual DPDT, Low RON, Low Capacitance, QFN 16, 1.8 x 2.6 x 0.75, 0.4mm Pitch, 3000-REEL NX3DV3899GU,115 vs NLAS3899BMNTBG

NX3DV3899GU,115 Related Parts

NX3DV3899GU,115 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.

  • Use 100 nF and 10 μF capacitors in parallel, placed as close as possible to the device's power pins. Ensure a low-ESR capacitor for the 100 nF capacitor.

  • Use a 10 kΩ pull-up resistor and a 100 nF capacitor on the POR pin. Ensure a clean power-up sequence and a stable voltage supply.

  • Follow IPC-A-610 standards for PCB assembly. For rework, use a low-temperature soldering iron (< 350°C) and a solder with a melting point below 220°C.

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