Part Details for PCF21219DUGR/DAZ by NXP Semiconductors
Overview of PCF21219DUGR/DAZ by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for PCF21219DUGR/DAZ
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
41X4171
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Newark | Pcf21219Dugr/Uncased/Waflm3//Da Rohs Compliant: Yes |Nxp PCF21219DUGR/DAZ Min Qty: 9240 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for PCF21219DUGR/DAZ
PCF21219DUGR/DAZ CAD Models
PCF21219DUGR/DAZ Part Data Attributes
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PCF21219DUGR/DAZ
NXP Semiconductors
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Datasheet
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PCF21219DUGR/DAZ
NXP Semiconductors
PCF21219 - LCD driver for character displays
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Manufacturer Package Code | NAU000 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| Data Input Mode | SERIAL | |
| Display Mode | DOT MATRIX | |
| Input Characteristics | STANDARD | |
| Interface IC Type | LIQUID CRYSTAL DISPLAY DRIVER | |
| JESD-30 Code | R-XUUC-N168 | |
| Length | 7.6 mm | |
| Multiplexed Display Capability | YES | |
| Number of Digits/Characters | 32-CHARACTER | |
| Number of Functions | 1 | |
| Number of Terminals | 168 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.4025 mm | |
| Supply Current-Max | 50 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 3 V | |
| Supply Voltage1-Max | 6.5 V | |
| Supply Voltage1-Min | 2.5 V | |
| Supply Voltage1-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 1.7 mm | |
| fmax-Min | 0.4 MHz |