PNX1301EH,557
NXP Semiconductors
Description: IC, SOT553-1 Package, Standard Marking, Tray Dry Pack,Bakeable,Multiple

Overview of PNX1301EH,557 by NXP Semiconductors

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  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
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  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )

CAD Models for PNX1301EH,557 by NXP Semiconductors
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Part Data Attributes for PNX1301EH,557 by NXP Semiconductors

PNX1301EH,557
NXP Semiconductors
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
Consumer IC Type
CONSUMER CIRCUIT
JESD-30 Code
S-PBGA-B292
Number of Terminals
292
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA292,20X20,50
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
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  1. PNX1301EH,557
    NXP Semiconductors
    IC, SOT553-1 Package, Standard Marking, Tray Dry Pack,Bakeable,Multiple
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