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Overview of PZU3.9B2L,315 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Environmental Monitoring
Audio and Video Systems
Aerospace and Defense
Energy and Power Systems
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Renewable Energy
Electronic Manufacturing
Automotive
CAD Models for PZU3.9B2L,315 by NXP Semiconductors
Part Data Attributes for PZU3.9B2L,315 by NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Part Package Code
|
DFN
|
Pin Count
|
2
|
Manufacturer Package Code
|
SOD882
|
Reach Compliance Code
|
compliant
|
Configuration
|
SINGLE
|
Diode Type
|
ZENER DIODE
|
Dynamic Impedance-Max
|
90 Ω
|
JESD-609 Code
|
e3
|
Moisture Sensitivity Level
|
1
|
Number of Elements
|
1
|
Operating Temperature-Max
|
150 °C
|
Peak Reflow Temperature (Cel)
|
260
|
Power Dissipation-Max
|
0.5 W
|
Reference Voltage-Nom
|
3.98 V
|
Surface Mount
|
YES
|
Terminal Finish
|
TIN
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Voltage Tol-Max
|
2%
|
Working Test Current
|
5 mA
|