Part Details for RP-SEMC32DA1 by Panasonic Electronic Components
Results Overview of RP-SEMC32DA1 by Panasonic Electronic Components
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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Robotics and Drones
RP-SEMC32DA1 Information
RP-SEMC32DA1 by Panasonic Electronic Components is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for RP-SEMC32DA1
RP-SEMC32DA1 CAD Models
RP-SEMC32DA1 Part Data Attributes
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RP-SEMC32DA1
Panasonic Electronic Components
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Datasheet
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RP-SEMC32DA1
Panasonic Electronic Components
MC SERIES, EMMC, 32GB, ITEMP 153
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | PANASONIC CORP | |
| Package Description | LFBGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Panasonic | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 13 mm | |
| Memory Density | 274877906944 bit | |
| Memory IC Type | FLASH CARD | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 34359738368 words | |
| Number of Words Code | 32000000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Programming Voltage | 2.7 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Type | MLC NAND TYPE | |
| Width | 11.5 mm |