Datasheets
S25FL064LABBHV023 by:

Flash, 16MX4, PBGA24,

Part Details for S25FL064LABBHV023 by Infineon Technologies AG

Overview of S25FL064LABBHV023 by Infineon Technologies AG

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Price & Stock for S25FL064LABBHV023

Part # Distributor Description Stock Price Buy
DISTI # 448-S25FL064LABBHV023TR-ND
DigiKey IC FLASH 64MBIT SPI/QUAD 24BGA Min Qty: 2500 Lead time: 8 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,500 $1.2214
$1.2214 Buy Now
DISTI # S25FL064LABBHV023
Avnet Americas NOR Flash 64Mbit 16M X 4Bit/32M X 2Bit/64M X 1Bit Serial-SPI 24-Pin BGA T/R - Tape and Reel (Alt: S25FL064LABBHV023) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 7 Weeks, 0 Days Container: Reel 0
  • 2,500 $1.1109
$1.1109 Buy Now
DISTI # 727-S25FL064LABHV023
Mouser Electronics NOR Flash Nor RoHS: Compliant 0
  • 2,500 $1.2400
  • 5,000 $1.2200
$1.2200 / $1.2400 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks 0
  • 2,500 $0.9990
$0.9990 Buy Now
DISTI # SP005657959
EBV Elektronik (Alt: SP005657959) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks, 0 Days EBV - 0
Buy Now

Part Details for S25FL064LABBHV023

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S25FL064LABBHV023 Part Data Attributes

S25FL064LABBHV023 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
S25FL064LABBHV023 Infineon Technologies AG Flash, 16MX4, PBGA24,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Reach Compliance Code compliant
Factory Lead Time 7 Weeks
Samacsys Manufacturer Infineon
Additional Feature IT ALSO HAVE X1 MEMORY WIDTH
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 108 MHz
Data Retention Time-Min 20
JESD-30 Code R-PBGA-B24
JESD-609 Code e1
Length 8 mm
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 24
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00007 A
Supply Current-Max 0.000029999999999999997 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

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