Part Details for S25FS256SAGBHI300 by Infineon Technologies AG
Overview of S25FS256SAGBHI300 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for S25FS256SAGBHI300
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
29X1013
|
Newark | Nor/Tray Rohs Compliant: Yes |Infineon S25FS256SAGBHI300 RoHS: Compliant Min Qty: 676 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
DISTI #
SP005654609
|
EBV Elektronik | NOR Flash Serial-SPI 1.8V 256Mbit 256M x 1bit 24-Pin FBGA Tray (Alt: SP005654609) RoHS: Compliant Min Qty: 338 Package Multiple: 338 Lead time: 100 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for S25FS256SAGBHI300
S25FS256SAGBHI300 CAD Models
S25FS256SAGBHI300 Part Data Attributes
|
S25FS256SAGBHI300
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
S25FS256SAGBHI300
Infineon Technologies AG
Flash, 32MX8, PDGA24, BGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | BGA-24 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Infineon | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 2 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,4X6,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | QSPI | |
Standby Current-Max | 0.0003 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FS256SAGBHI300
This table gives cross-reference parts and alternative options found for S25FS256SAGBHI300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FS256SAGBHI300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
S25FS256SAGBHI303 | Flash, 32MX8, PDGA24, BGA-24 | Infineon Technologies AG | S25FS256SAGBHI300 vs S25FS256SAGBHI303 |