Part Details for S3090DI by Applied Micro Circuits Corporation
Overview of S3090DI by Applied Micro Circuits Corporation
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
Part Details for S3090DI
S3090DI CAD Models
S3090DI Part Data Attributes
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S3090DI
Applied Micro Circuits Corporation
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Datasheet
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S3090DI
Applied Micro Circuits Corporation
Telecom Circuit, 1-Func, GAAS, DIE-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | APPLIED MICRO CIRCUITS CORP | |
Part Package Code | DIE | |
Package Description | DIE, DIE OR CHIP | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-XUUC-N28 | |
Length | 1.8 mm | |
Neg Supply Voltage-Nom | -5.2 V | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | SQUARE | |
Package Style | UNCASED CHIP | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | GAAS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Width | 1.8 mm |