Part Details for S32G233AABK0CUCR by NXP Semiconductors
Overview of S32G233AABK0CUCR by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Aerospace and Defense
Automotive
Price & Stock for S32G233AABK0CUCR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
37AJ4775
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Newark | S32G233A Arm Cortex-M7 And -A53 , Hse, Llce, Pfe, Pcie, 20X Can Fd, 4X Gbe - Vehicle Network Processor/ Reel Rohs Compliant: Yes |Nxp S32G233AABK0CUCR Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$50.0200 / $50.8600 | Buy Now |
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DISTI #
568-S32G233AABK0CUCRTR-ND
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DigiKey | S32G233A ARM CORTEX-M7 AND -A53 Min Qty: 500 Lead time: 8 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$56.0102 | Buy Now |
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DISTI #
S32G233AABK0CUCR
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Avnet Americas | - Tape and Reel (Alt: S32G233AABK0CUCR) Min Qty: 500 Package Multiple: 500 Lead time: 26 Weeks, 0 Days Container: Reel | 0 |
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$52.1172 / $60.1029 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Lead time: 26 Weeks Container: Reel | 0Reel |
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$56.0400 | Buy Now |
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DISTI #
S32G233AABK0CUCR
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EBV Elektronik | (Alt: S32G233AABK0CUCR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 28 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for S32G233AABK0CUCR
S32G233AABK0CUCR CAD Models
S32G233AABK0CUCR Part Data Attributes
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S32G233AABK0CUCR
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
S32G233AABK0CUCR
NXP Semiconductors
SoC
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 26 Weeks | |
| JESD-30 Code | S-PBGA-B525 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 525 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA525,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.12 mm | |
| Supply Voltage-Max | 0.87 V | |
| Supply Voltage-Min | 0.72 V | |
| Supply Voltage-Nom | 0.77 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |