Part Details for SA636DK/02J by NXP Semiconductors
Overview of SA636DK/02J by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SA636DK/02J
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
42AH0828
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Newark | Low Voltage High Performance Mixer Fm If System With High-Speed Rssi Rohs Compliant: Yes |Nxp SA636DK/02J Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Part Details for SA636DK/02J
SA636DK/02J CAD Models
SA636DK/02J Part Data Attributes:
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SA636DK/02J
NXP Semiconductors
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Datasheet
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SA636DK/02J
NXP Semiconductors
Telecom Circuit
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2019-10-08 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e4 | |
| Length | 6.5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSSOP | |
| Package Equivalence Code | SSOP20,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm |