Part Details for SC16C850IBS,151 by NXP Semiconductors
Overview of SC16C850IBS,151 by NXP Semiconductors
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Part Details for SC16C850IBS,151
SC16C850IBS,151 CAD Models
SC16C850IBS,151 Part Data Attributes:
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SC16C850IBS,151
NXP Semiconductors
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SC16C850IBS,151
NXP Semiconductors
SC16C850 - 2.5 V to 3.3 V UART, 16 mode or 68 mode parallel bus interface QFN 32-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | 5 X 5 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-220, SOT617-1, HVQFN-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT617-1 | |
| Reach Compliance Code | unknown | |
| Additional Feature | CAN ALSO OPERATE AT 2.5V SUPPLY | |
| Address Bus Width | 3 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 80 MHz | |
| Communication Protocol | ASYNC, BIT | |
| Data Transfer Rate-Max | 0.625 MBps | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQCC-N32 | |
| JESD-609 Code | e4 | |
| Length | 5 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |