Datasheets
SIGC06T65GEX1SA1 by: Infineon Technologies AG

Insulated Gate Bipolar Transistor, 650V V(BR)CES, N-Channel, DIE-2

Part Details for SIGC06T65GEX1SA1 by Infineon Technologies AG

Overview of SIGC06T65GEX1SA1 by Infineon Technologies AG

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Applications Space Technology Internet of Things (IoT) Industrial Automation Energy and Power Systems Renewable Energy Electronic Manufacturing Communication and Networking Robotics and Drones

Price & Stock for SIGC06T65GEX1SA1

Part # Distributor Description Stock Price Buy
DISTI # SIGC06T65GEX1SA1
Avnet Americas IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T65GEX1SA1) RoHS: Compliant Min Qty: 42570 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Waffle Pack 0
  • 42,570 $0.8994
  • 43,000 $0.8713
  • 86,000 $0.8431
  • 220,000 $0.8151
  • 430,000 $0.7869
$0.7869 / $0.8994 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 42570 Package Multiple: 1 Lead time: 20 Weeks 0
  • 42,570 $0.7500
$0.7500 Buy Now

Part Details for SIGC06T65GEX1SA1

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SIGC06T65GEX1SA1 Part Data Attributes

SIGC06T65GEX1SA1 Infineon Technologies AG
Buy Now Datasheet
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SIGC06T65GEX1SA1 Infineon Technologies AG Insulated Gate Bipolar Transistor, 650V V(BR)CES, N-Channel, DIE-2
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description UNCASED CHIP, R-XUUC-N2
Reach Compliance Code compliant
ECCN Code EAR99
Factory Lead Time 20 Weeks
Collector-Emitter Voltage-Max 650 V
Configuration SINGLE
JESD-30 Code R-XUUC-N2
Number of Elements 1
Number of Terminals 2
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Surface Mount YES
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application POWER CONTROL
Transistor Element Material SILICON

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