Part Details for SIGC68T170R3EX1SA1 by Infineon Technologies AG
Overview of SIGC68T170R3EX1SA1 by Infineon Technologies AG
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Industrial Automation
Motor control systems
Price & Stock for SIGC68T170R3EX1SA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SIGC68T170R3EX1SA1
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Avnet Americas | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1) RoHS: Compliant Min Qty: 3528 Package Multiple: 1 Lead time: 30 Weeks, 0 Days Container: Waffle Pack | 0 |
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$10.5062 / $12.0070 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3528 Package Multiple: 1 | 0 |
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$10.5700 | Buy Now |
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DISTI #
SIGC68T170R3EX1SA1
|
Avnet Americas | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1) RoHS: Compliant Min Qty: 3528 Package Multiple: 1 Lead time: 30 Weeks, 0 Days Container: Waffle Pack | 0 |
|
$10.5062 / $12.0070 | Buy Now |
|
DISTI #
SIGC68T170R3EX1SA1
|
Avnet Americas | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1) RoHS: Compliant Min Qty: 3528 Package Multiple: 1 Lead time: 30 Weeks, 0 Days Container: Waffle Pack | 0 |
|
$10.5062 / $12.0070 | Buy Now |
Part Details for SIGC68T170R3EX1SA1
SIGC68T170R3EX1SA1 CAD Models
SIGC68T170R3EX1SA1 Part Data Attributes
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SIGC68T170R3EX1SA1
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
SIGC68T170R3EX1SA1
Infineon Technologies AG
Insulated Gate Bipolar Transistor, 50A I(C), 1700V V(BR)CES, N-Channel, 8.23 X 8.25 MM, DIE
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | UNCASED CHIP, R-XUUC-N | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 30 Weeks | |
| Collector Current-Max (IC) | 50 A | |
| Collector-Emitter Voltage-Max | 1700 V | |
| Configuration | SINGLE | |
| JESD-30 Code | R-XUUC-N | |
| Number of Elements | 1 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Surface Mount | YES | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | POWER CONTROL | |
| Transistor Element Material | SILICON |