Datasheets
SII9136CTU-3 by:

Consumer Circuit,

Part Details for SII9136CTU-3 by Lattice Semiconductor Corporation

Results Overview of SII9136CTU-3 by Lattice Semiconductor Corporation

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Price & Stock for SII9136CTU-3

Part # Distributor Description Stock Price Buy
Ameya Holding Limited   514
RFQ

Part Details for SII9136CTU-3

SII9136CTU-3 CAD Models

SII9136CTU-3 Part Data Attributes

SII9136CTU-3 Lattice Semiconductor Corporation
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SII9136CTU-3 Lattice Semiconductor Corporation Consumer Circuit,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP
Package Description TQFP-100
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Consumer IC Type CONSUMER CIRCUIT
JESD-30 Code S-PQFP-G100
Length 14 mm
Number of Functions 1
Number of Terminals 100
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HTFQFP
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 1.26 V
Supply Voltage-Min (Vsup) 1.14 V
Surface Mount YES
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

SII9136CTU-3 Frequently Asked Questions (FAQ)

  • The recommended PCB layout for the SII9136CTU-3 involves placing the device near the center of the board, with power and ground planes on inner layers, and using a solid ground plane under the device to reduce noise and improve signal integrity.

  • To optimize the clock tree for the SII9136CTU-3, use a clock tree architecture that minimizes clock skew and ensures that all clock signals are routed with matched lengths and impedances. Additionally, use a clock buffer or clock generator to ensure a clean and stable clock signal.

  • The SII9136CTU-3 has a maximum junction temperature of 125°C. To ensure reliable operation, provide adequate heat sinking and thermal management, such as using a heat sink or thermal pad, and ensure good airflow around the device.

  • Implement power sequencing for the SII9136CTU-3 by ensuring that the power supplies are turned on in the correct order, with the core voltage (VCC) turned on first, followed by the I/O voltage (VCCIO). Use a power sequencing controller or a power management IC to ensure proper power-up and power-down sequences.

  • To minimize EMI and RFI, use a multi-layer PCB with a solid ground plane, and ensure that all signal lines are routed away from the edges of the board. Use shielding or EMI filters on I/O lines, and consider using a Faraday cage or EMI shield around the device.

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