Part Details for SL3S1013FTB0 by NXP Semiconductors
Overview of SL3S1013FTB0 by NXP Semiconductors
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Applications
Energy and Power Systems
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Automotive
Part Details for SL3S1013FTB0
SL3S1013FTB0 CAD Models
SL3S1013FTB0 Part Data Attributes
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SL3S1013FTB0
NXP Semiconductors
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Datasheet
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SL3S1013FTB0
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PDSO6, 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | XSON-6 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.32.00 | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | R-PDSO-N6 | |
Length | 1.45 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VSON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.5 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Pure Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 1 mm |