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14.2-Gbps quad mux, linear-redriver with signal conditioning 167-NFBGA -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
SN65LVCP114ZJA by Texas Instruments is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Ameya Holding Limited | 16714.2G QUAD 1:2-2:1 MUX-REDRIVER | 64358 |
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RFQ | |
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Win Source Electronics | 14.2-Gbps Quad 1:2-2:1 MUX, Linear-Redriver With Signal Conditioning | 1500 |
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$22.8873 / $34.3310 | Buy Now |
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SN65LVCP114ZJA
Texas Instruments
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Datasheet
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SN65LVCP114ZJA
Texas Instruments
14.2-Gbps quad mux, linear-redriver with signal conditioning 167-NFBGA -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | BGA-167 | |
Pin Count | 167 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Data Rate | 14200000 Mbps | |
JESD-30 Code | S-PBGA-B167 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of Channels | 8 | |
Number of Functions | 4 | |
Number of Terminals | 167 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA167,14X14,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm |