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Low-Power Configurable Multiple-Function Gate 6-DSBGA -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-SN74AUP1G58YZPR-ND
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DigiKey | IC CONFIG MULTI-FUNC GATE 6DSBGA Min Qty: 1 Lead time: 18 Weeks Container: Bulk MARKETPLACE PRODUCT |
36058 In Stock |
|
$0.2500 | Buy Now |
DISTI #
296-SN74AUP1G58YZPRCT-ND
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DigiKey | IC CONFIG MULTI-FUNC GATE 6DSBGA Min Qty: 1 Lead time: 18 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) | Temporarily Out of Stock |
|
$0.2308 / $0.6300 | Buy Now |
DISTI #
595-SN74AUP1G58YZPR
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Mouser Electronics | Logic Gates LoPwrCnfgrble MultFunctionGt RoHS: Compliant | 1002 |
|
$0.2140 / $0.6400 | Buy Now |
|
Rochester Electronics | SN74AUP1G58 Low-Power Configurable Multiple-Function Gate RoHS: Compliant Status: Active Min Qty: 1 | 15000 |
|
$0.2107 / $0.2479 | Buy Now |
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SN74AUP1G58YZPR
Texas Instruments
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Datasheet
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SN74AUP1G58YZPR
Texas Instruments
Low-Power Configurable Multiple-Function Gate 6-DSBGA -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | GREEN, DSBGA-6 | |
Pin Count | 6 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Family | AUP/ULP/V | |
JESD-30 Code | R-XBGA-B6 | |
JESD-609 Code | e1 | |
Length | 1.4 mm | |
Load Capacitance (CL) | 30 pF | |
Logic IC Type | MAJORITY LOGIC GATE | |
Max I(ol) | 0.004 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inputs | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | VFBGA | |
Package Equivalence Code | BGA6,2X3,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Power Supply Current-Max (ICC) | 0.0009 mA | |
Propagation Delay (tpd) | 26.2 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | YES | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 0.8 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 0.9 mm |