Datasheets
SP1115-01UTG by: Littelfuse Inc

Trans Voltage Suppressor Diode,

Part Details for SP1115-01UTG by Littelfuse Inc

Results Overview of SP1115-01UTG by Littelfuse Inc

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SP1115-01UTG Information

SP1115-01UTG by Littelfuse Inc is a Transient Suppressor.
Transient Suppressors are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for SP1115-01UTG

Part # Distributor Description Stock Price Buy
DISTI # 34AC6174
Newark 30Kv 15V 30A Tvs Diod Udfn-2/ Tr |Littelfuse SP1115-01UTG RoHS: Not Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 1 $0.1390
  • 5,000 $0.1310
  • 10,000 $0.1140
  • 20,000 $0.1020
  • 30,000 $0.0940
  • 50,000 $0.0850
$0.0850 / $0.1390 Buy Now

Part Details for SP1115-01UTG

SP1115-01UTG CAD Models

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SP1115-01UTG Part Data Attributes

SP1115-01UTG Littelfuse Inc
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SP1115-01UTG Littelfuse Inc Trans Voltage Suppressor Diode,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer LITTELFUSE INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Samacsys Manufacturer LITTELFUSE
Breakdown Voltage-Min 16.7 V
Clamping Voltage-Max 30.2 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code R-PBCC-N2
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL
Reference Standard AEC-Q101; IEC-61000-4-2, 4-4
Rep Pk Reverse Voltage-Max 15 V
Reverse Current-Max 1 µA
Reverse Test Voltage 15 V
Surface Mount YES
Technology AVALANCHE
Terminal Form NO LEAD
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

SP1115-01UTG Frequently Asked Questions (FAQ)

  • A good PCB layout for the SP1115-01UTG involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.

  • Proper thermal management involves providing adequate airflow, using a heat sink if necessary, and ensuring the device is mounted on a PCB with a sufficient thermal conductivity. The device's thermal pad should be soldered to a copper plane on the PCB to facilitate heat dissipation.

  • Exceeding the maximum junction temperature of 150°C can lead to reduced lifespan, decreased performance, and potentially even device failure. It is essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.

  • While the SP1115-01UTG is a high-quality device, it may not meet the specific requirements of high-reliability or aerospace applications. Engineers should consult with Littelfuse Inc or a qualified representative to determine the device's suitability for such applications.

  • To troubleshoot issues with the SP1115-01UTG, engineers should check the input voltage, output current, and PCB layout for any anomalies. They should also verify that the device is properly soldered and that the thermal management is adequate. If issues persist, consult the datasheet or contact Littelfuse Inc for further assistance.

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