Part Details for SP5745BBK1AMMH6R by NXP Semiconductors
Overview of SP5745BBK1AMMH6R by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Financial Technology (Fintech)
Automotive
Robotics and Drones
Price & Stock for SP5745BBK1AMMH6R
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
33AC4472
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Newark | 32 Bit, single Core,2M Flash,160Mhz/ Reel Rohs Compliant: Yes |Nxp SP5745BBK1AMMH6R RoHS: Compliant Min Qty: 1500 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$17.5500 | Buy Now |
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DISTI #
SP5745BBK1AMMH6R-ND
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DigiKey | IC MCU 32BIT 2MB FLASH 100MAPBGA Min Qty: 1500 Lead time: 52 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$16.1250 | Buy Now |
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DISTI #
SP5745BBK1AMMH6R
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Avnet Americas | 32 Bit,SINGLE CORE,2M FL - Tape and Reel (Alt: SP5745BBK1AMMH6R) Min Qty: 1500 Package Multiple: 1500 Lead time: 52 Weeks, 0 Days Container: Reel | 0 |
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$17.6831 | Buy Now |
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DISTI #
771-SP5745BBK1AMMH6R
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Mouser Electronics | 32-bit Microcontrollers - MCU 32 Bit,SINGLE CORE,2M FLASH,160MHz RoHS: Compliant | 0 |
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$18.2300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1500 Package Multiple: 1500 Lead time: 52 Weeks Container: Reel | 0Reel |
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$19.8500 | Buy Now |
Part Details for SP5745BBK1AMMH6R
SP5745BBK1AMMH6R CAD Models
SP5745BBK1AMMH6R Part Data Attributes
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SP5745BBK1AMMH6R
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SP5745BBK1AMMH6R
NXP Semiconductors
RISC Microcontroller
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MAPBGA-100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | E200Z4 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e2 | |
| Length | 11 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 32 | |
| Number of External Interrupts | 1 | |
| Number of I/O Lines | 65 | |
| Number of Terminals | 100 | |
| Number of Timers | 64 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,10X10,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 262144 | |
| ROM (words) | 2097152 | |
| ROM Programmability | FLASH | |
| Screening Level | ISO 26262 | |
| Seated Height-Max | 1.41 mm | |
| Speed | 160 MHz | |
| Supply Current-Max | 264 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 11 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |