Part Details for SPC5534MVZ80 by NXP Semiconductors
Overview of SPC5534MVZ80 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SPC5534MVZ80
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25AJ2832
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Newark | Mcu, 12Bit, 80Mhz, Tepbga-324, Product Range:Mpc5 Family Mpc55Xx Series Microcontrollers, Device Core:Power Architecture, Data Bus Width:32 Bit, Operating Frequency Max:80Mhz, Program Memory Size:1Mb, No. Of Pins:324Pins Rohs Compliant: Yes |Nxp SPC5534MVZ80 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$37.5800 / $42.5500 | Buy Now |
DISTI #
23AC9808
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Newark | Nxp 32-Bit Mcu, Power Arch Core, 1Mb Flash, 80Mhz, -40/+125Degc, Automotive Grade, Pbga 324 Rohs Compliant: Yes |Nxp SPC5534MVZ80 RoHS: Compliant Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$34.8400 | Buy Now |
DISTI #
SPC5534MVZ80-ND
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DigiKey | IC MCU 32BIT 1MB FLASH 324PBGA Min Qty: 300 Lead time: 12 Weeks Container: Tray | Limited Supply - Call |
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$30.4500 | Buy Now |
DISTI #
SPC5534MVZ80
|
Avnet Americas | MCU 32-bit MPC55xx e200 RISC 3072KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray - Trays (Alt: SPC5534MVZ80) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 12 Weeks, 0 Days Container: Tray | 1200 |
|
$26.7960 | Buy Now |
DISTI #
841-SPC5534MVZ80
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Mouser Electronics | 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 324 RoHS: Compliant | 300 |
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$35.5400 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 300 Package Multiple: 300 Lead time: 12 Weeks Container: Tray | 0Tray |
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$37.4800 | Buy Now |
DISTI #
SPC5534MVZ80
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Avnet Silica | MCU 32-bit MPC55xx e200 RISC 3072KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray (Alt: SPC5534MVZ80) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 26 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
SPC5534MVZ80
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EBV Elektronik | MCU 32-bit MPC55xx e200 RISC 3072KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray (Alt: SPC5534MVZ80) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 26 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for SPC5534MVZ80
SPC5534MVZ80 CAD Models
SPC5534MVZ80 Part Data Attributes
|
SPC5534MVZ80
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
SPC5534MVZ80
NXP Semiconductors
FLASH, 80MHz, RISC MICROCONTROLLER, PBGA324
|
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 23 X 23 MM, 2.55 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, BGA-324 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Additional Feature | ASLO OPERATES 3.3 V TYP SUPPLY | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | E200 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 192 | |
Number of Terminals | 324 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 1048576 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 2.55 mm | |
Speed | 80 MHz | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |