Part Details for SSTUAF32869AHLF by Integrated Device Technology Inc
Overview of SSTUAF32869AHLF by Integrated Device Technology Inc
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Part Details for SSTUAF32869AHLF
SSTUAF32869AHLF CAD Models
SSTUAF32869AHLF Part Data Attributes
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SSTUAF32869AHLF
Integrated Device Technology Inc
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Datasheet
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SSTUAF32869AHLF
Integrated Device Technology Inc
CABGA-150, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | LEAD FREE, BGA-150 | |
| Pin Count | 150 | |
| Manufacturer Package Code | BKG150 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Family | 32869 | |
| JESD-30 Code | R-PBGA-B150 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Moisture Sensitivity Level | 3 | |
| Number of Bits | 14 | |
| Number of Functions | 1 | |
| Number of Terminals | 150 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Characteristics | OPEN-DRAIN | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 1.9 ns | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Trigger Type | POSITIVE EDGE | |
| Width | 8 mm | |
| fmax-Min | 340 MHz |