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Part Details for ST2100 by STMicroelectronics
Overview of ST2100 by STMicroelectronics
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Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Smart Cities
Transportation and Logistics
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Automotive
Consumer Electronics
Security and Surveillance
Aerospace and Defense
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for ST2100
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
59AC7814
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Newark | Smart Grid |Stmicroelectronics ST2100 Min Qty: 1134 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
|
DISTI #
497-16462-ND
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DigiKey | IC BROADBAND FRONT-END 373TFBGA Min Qty: 1134 Lead time: 35 Weeks Container: Tray | Temporarily Out of Stock |
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$15.5580 | Buy Now |
|
DISTI #
ST2100
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Avnet Americas | MPU RISC 32-Bit 333MHz 3.3V 373-Pin TF-BGA Tray - Trays (Alt: ST2100) RoHS: Compliant Min Qty: 1134 Package Multiple: 1134 Lead time: 35 Weeks, 0 Days Container: Tray | 0 |
|
$15.4632 / $17.5961 | Buy Now |
|
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STMicroelectronics | Broadband powerline communication SoC optimized for audio/video streaming and consumer applications RoHS: Compliant Min Qty: 1 | 0 |
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$18.4100 / $25.0100 | Buy Now |
|
|
Future Electronics | Broadband powerline communication SoC, TFBGA RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: Bulk | 621Bulk |
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$15.2600 / $16.0200 | Buy Now |
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Future Electronics | Broadband powerline communication SoC, TFBGA RoHS: Compliant pbFree: Yes Min Qty: 1134 Package Multiple: 1134 Container: Bulk | 0Bulk |
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$15.2600 | Buy Now |
|
DISTI #
ST2100
|
Avnet Americas | MPU RISC 32-Bit 333MHz 3.3V 373-Pin TF-BGA Tray - Trays (Alt: ST2100) RoHS: Compliant Min Qty: 1134 Package Multiple: 1134 Lead time: 35 Weeks, 0 Days Container: Tray | 0 |
|
$15.4632 / $17.5961 | Buy Now |
|
DISTI #
ST2100
|
Avnet Americas | MPU RISC 32-Bit 333MHz 3.3V 373-Pin TF-BGA Tray - Trays (Alt: ST2100) RoHS: Compliant Min Qty: 1134 Package Multiple: 1134 Lead time: 35 Weeks, 0 Days Container: Tray | 0 |
|
$15.4632 / $17.5961 | Buy Now |
|
DISTI #
ST2100
|
Avnet Silica | MPU RISC 32-Bit 333MHz 3.3V 373-Pin TF-BGA Tray (Alt: ST2100) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 2 Weeks, 3 Days | Silica - 0 |
|
Buy Now | |
|
|
Chip1Cloud | Broadband powerline communication SoC optimized | 7900 |
|
RFQ |
Part Details for ST2100
ST2100 CAD Models
ST2100 Part Data Attributes
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ST2100
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
ST2100
STMicroelectronics
Broadband powerline communication SoC optimized for audio/video streaming and consumer applications
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | TFBGA-373 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 35 Weeks | |
| Samacsys Manufacturer | STMicroelectronics | |
| Address Bus Width | 15 | |
| Boundary Scan | YES | |
| Bus Compatibility | CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B373 | |
| Length | 12 mm | |
| Number of I/O Lines | 40 | |
| Number of Serial I/Os | 4 | |
| Number of Terminals | 373 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA373,23X23,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (words) | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.08 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL |