Part Details for ST70136B by STMicroelectronics
Overview of ST70136B by STMicroelectronics
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for ST70136B
ST70136B CAD Models
ST70136B Part Data Attributes
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ST70136B
STMicroelectronics
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Datasheet
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ST70136B
STMicroelectronics
MODEM-SUPPORT CIRCUIT, PBGA64, 8 X 8 MM, 1.70 MM HEIGHT, LFBGA-64
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA64,8X8,32 | |
Pin Count | 64 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B64 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Number of Functions | 1 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA64,8X8,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Surface Mount | YES | |
Technology | BICMOS | |
Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |