Part Details for STPAC01F2 by STMicroelectronics
Overview of STPAC01F2 by STMicroelectronics
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for STPAC01F2
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 10000 |
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RFQ | ||
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Quest Components | SPECIALTY TELECOM CIRCUIT, PBGA8 | 176 |
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$0.5278 / $1.1310 | Buy Now |
Part Details for STPAC01F2
STPAC01F2 CAD Models
STPAC01F2 Part Data Attributes
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STPAC01F2
STMicroelectronics
Buy Now
Datasheet
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STPAC01F2
STMicroelectronics
SPECIALTY TELECOM CIRCUIT, PBGA8, ROHS COMPLIANT, FLIP-CHIP-8
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | VFBGA, | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B8 | |
| Length | 1.57 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.715 mm | |
| Supply Voltage-Nom | 2.7 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 1.57 mm |